GET https://kbin.spritesserver.nl/m/electronics@discuss.tchncs.de/t/2237/Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of

Response
200 OK
IP
3.145.199.113
Profiled on
Token
17f314

Security

Token

There is no security token.

Firewall

main Name
Security enabled
Stateless

Configuration

Key Value
provider security.user.provider.concrete.app_user_provider
context main
entry_point App\Security\KbinAuthenticator
user_checker App\Security\UserChecker
access_denied_handler (none)
access_denied_url (none)
authenticators 
[
  "two_factor"
  "remember_me"
  "App\Security\KbinAuthenticator"
  "App\Security\FacebookAuthenticator"
  "App\Security\GoogleAuthenticator"
  "App\Security\GithubAuthenticator"
  "App\Security\KeycloakAuthenticator"
]

Listeners

Listener Duration Response 
Symfony\Component\Security\Http\Firewall\ChannelListener {#723
  -map: Symfony\Component\Security\Http\AccessMap {#722 …}
  -logger: Monolog\Logger {#783 …}
  -httpPort: 80
  -httpsPort: 443
}
 0.00 ms (none) 
Symfony\Component\Security\Http\Firewall\ContextListener {#706
  -tokenStorage: Symfony\Component\Security\Core\Authentication\Token\Storage\TokenStorage {#1017 …}
  -sessionKey: "_security_main"
  -logger: Monolog\Logger {#783 …}
  -userProviders: Symfony\Component\DependencyInjection\Argument\RewindableGenerator {#705 …}
  -dispatcher: Symfony\Component\EventDispatcher\Debug\TraceableEventDispatcher {#747 …}
  -registered: false
  -trustResolver: Scheb\TwoFactorBundle\Security\Authentication\AuthenticationTrustResolver {#780 …}
  -sessionTrackerEnabler: Symfony\Component\Security\Core\Authentication\Token\Storage\UsageTrackingTokenStorage::enableUsageTracking(): void {#703 …}
}
 0.21 ms (none) 
Symfony\Component\Security\Http\Firewall\AuthenticatorManagerListener {#584
  -authenticatorManager: Symfony\Component\Security\Http\Authentication\AuthenticatorManager {#595 …}
}
 0.00 ms (none) 
Scheb\TwoFactorBundle\Security\Http\Firewall\TwoFactorAccessListener {#582
  -twoFactorFirewallConfig: Scheb\TwoFactorBundle\Security\TwoFactor\TwoFactorFirewallConfig {#842 …}
  -tokenStorage: Symfony\Component\Security\Core\Authentication\Token\Storage\UsageTrackingTokenStorage {#1018 …}
  -twoFactorAccessDecider: Scheb\TwoFactorBundle\Security\Authorization\TwoFactorAccessDecider {#581 …}
}
 0.05 ms (none) 
Symfony\Component\Security\Http\Firewall\AccessListener {#579
  -tokenStorage: Symfony\Component\Security\Core\Authentication\Token\Storage\UsageTrackingTokenStorage {#1018 …}
  -accessDecisionManager: Symfony\Component\Security\Core\Authorization\TraceableAccessDecisionManager {#937 …}
  -map: Symfony\Component\Security\Http\AccessMap {#722 …}
}
 0.00 ms (none) 
Symfony\Component\Security\Http\Firewall\LogoutListener {#786
  -tokenStorage: Symfony\Component\Security\Core\Authentication\Token\Storage\UsageTrackingTokenStorage {#1018 …}
  -options: [
    "csrf_parameter" => "_csrf_token"
    "csrf_token_id" => "logout"
    "logout_path" => "app_logout"
  ]
  -httpUtils: Symfony\Component\Security\Http\HttpUtils {#841 …}
  -csrfTokenManager: Symfony\Component\Security\Csrf\CsrfTokenManager {#1015 …}
  -eventDispatcher: Symfony\Component\EventDispatcher\Debug\TraceableEventDispatcher {#747 …}
}
 0.00 ms (none)

Authenticators

No authenticators have been recorded. Check previous profiles on your authentication endpoint.

Access Decision

affirmative Strategy
# Voter class
1 
"Symfony\Component\Security\Core\Authorization\Voter\AuthenticatedVoter"
2 
"Scheb\TwoFactorBundle\Security\Authorization\Voter\TwoFactorInProgressVoter"
3 
"Symfony\Component\Security\Core\Authorization\Voter\RoleHierarchyVoter"
4 
"Symfony\Component\Security\Core\Authorization\Voter\ExpressionVoter"
5 
"App\Security\Voter\EntryCommentVoter"
6 
"App\Security\Voter\EntryVoter"
7 
"App\Security\Voter\MagazineVoter"
8 
"App\Security\Voter\MessageThreadVoter"
9 
"App\Security\Voter\MessageVoter"
10 
"App\Security\Voter\NotificationVoter"
11 
"App\Security\Voter\OAuth2UserConsentVoter"
12 
"App\Security\Voter\PostCommentVoter"
13 
"App\Security\Voter\PostVoter"
14 
"App\Security\Voter\UserVoter"

Access decision log

# Result Attributes Object
1 DENIED ROLE_USER 
null
 
"Scheb\TwoFactorBundle\Security\Authorization\Voter\TwoFactorInProgressVoter"
 ACCESS ABSTAIN 
"Symfony\Component\Security\Core\Authorization\Voter\RoleHierarchyVoter"
 ACCESS DENIED 
"App\Security\Voter\EntryCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\EntryVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MagazineVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageThreadVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\NotificationVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\OAuth2UserConsentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\UserVoter"
 ACCESS ABSTAIN
Show voter details
2 DENIED moderate 
App\Entity\Entry {#2388
  +user: Proxies\__CG__\App\Entity\User {#1943 …}
  +magazine: App\Entity\Magazine {#266
    +icon: Proxies\__CG__\App\Entity\Image {#247 …}
    +name: "electronics@discuss.tchncs.de"
    +title: "electronics"
    +description: """
      **Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
      \n
      Rules\n
      -----\n
      \n
      1: Be nice.\n
      \n
      2: Be on-topic (eg: *Electronic*, not *electrical*).\n
      \n
      3: No commercial stuff, buying, selling or valuations.\n
      \n
      4: No circuit design or repair, tools or component questions.\n
      \n
      5: No excessively promoting your own sites, social media, videos etc.\n
      \n
      ---\n
      \n
      *Ask questions in [discuss.tchncs.de/c/askelectronics](https://discuss.tchncs.de/c/askelectronics)*\n
      \n
      ---
      """
    +rules: null
    +subscriptionsCount: 1
    +entryCount: 43
    +entryCommentCount: 201
    +postCount: 1
    +postCommentCount: 3
    +isAdult: false
    +customCss: null
    +lastActive: DateTime @1723220252 {#276
      date: 2024-08-09 18:17:32.0 +02:00
    }
    +markedForDeletionAt: null
    +tags: null
    +moderators: Doctrine\ORM\PersistentCollection {#238 …}
    +ownershipRequests: Doctrine\ORM\PersistentCollection {#234 …}
    +moderatorRequests: Doctrine\ORM\PersistentCollection {#223 …}
    +entries: Doctrine\ORM\PersistentCollection {#181 …}
    +posts: Doctrine\ORM\PersistentCollection {#139 …}
    +subscriptions: Doctrine\ORM\PersistentCollection {#201 …}
    +bans: Doctrine\ORM\PersistentCollection {#118 …}
    +reports: Doctrine\ORM\PersistentCollection {#104 …}
    +badges: Doctrine\ORM\PersistentCollection {#82 …}
    +logs: Doctrine\ORM\PersistentCollection {#72 …}
    +awards: Doctrine\ORM\PersistentCollection {#61 …}
    +categories: Doctrine\ORM\PersistentCollection {#1820 …}
    -id: 5
    +apId: "electronics@discuss.tchncs.de"
    +apProfileId: "https://discuss.tchncs.de/c/electronics"
    +apPublicUrl: "https://discuss.tchncs.de/c/electronics"
    +apFollowersUrl: "https://discuss.tchncs.de/c/electronics/followers"
    +apInboxUrl: "https://discuss.tchncs.de/inbox"
    +apDomain: "discuss.tchncs.de"
    +apPreferredUsername: "electronics"
    +apDiscoverable: true
    +apManuallyApprovesFollowers: null
    +privateKey: null
    +publicKey: null
    +apFetchedAt: DateTime @1719675646 {#270
      date: 2024-06-29 17:40:46.0 +02:00
    }
    +apDeletedAt: null
    +apTimeoutAt: null
    +visibility: "visible             "
    +createdAt: DateTimeImmutable @1686642591 {#272
      date: 2023-06-13 09:49:51.0 +02:00
    }
  }
  +image: null
  +domain: Proxies\__CG__\App\Entity\Domain {#1912 …}
  +slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
  +title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
  +url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
  +body: """
    As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
    \n
    To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
    \n
    The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
    """
  +type: "link"
  +lang: "en"
  +isOc: false
  +hasEmbed: false
  +commentCount: 1
  +favouriteCount: 10
  +score: 0
  +isAdult: false
  +sticky: false
  +lastActive: DateTime @1694877465 {#2410
    date: 2023-09-16 17:17:45.0 +02:00
  }
  +ip: null
  +adaAmount: 0
  +tags: null
  +mentions: null
  +comments: Doctrine\ORM\PersistentCollection {#1866 …}
  +votes: Doctrine\ORM\PersistentCollection {#1978 …}
  +reports: Doctrine\ORM\PersistentCollection {#1946 …}
  +favourites: Doctrine\ORM\PersistentCollection {#1971 …}
  +notifications: Doctrine\ORM\PersistentCollection {#2443 …}
  +badges: Doctrine\ORM\PersistentCollection {#2426 …}
  +children: []
  -id: 2237
  -titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
  -bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
  +cross: false
  +upVotes: 0
  +downVotes: 0
  +ranking: 1694903121
  +visibility: "visible             "
  +apId: "https://discuss.tchncs.de/post/3338875"
  +editedAt: null
  +createdAt: DateTimeImmutable @1694874121 {#1850
    date: 2023-09-16 16:22:01.0 +02:00
  }
}
 
"Scheb\TwoFactorBundle\Security\Authorization\Voter\TwoFactorInProgressVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\EntryCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\EntryVoter"
 ACCESS DENIED 
"App\Security\Voter\MagazineVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageThreadVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\NotificationVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\OAuth2UserConsentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\UserVoter"
 ACCESS ABSTAIN
Show voter details
3 DENIED edit 
App\Entity\Entry {#2388
  +user: Proxies\__CG__\App\Entity\User {#1943 …}
  +magazine: App\Entity\Magazine {#266
    +icon: Proxies\__CG__\App\Entity\Image {#247 …}
    +name: "electronics@discuss.tchncs.de"
    +title: "electronics"
    +description: """
      **Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
      \n
      Rules\n
      -----\n
      \n
      1: Be nice.\n
      \n
      2: Be on-topic (eg: *Electronic*, not *electrical*).\n
      \n
      3: No commercial stuff, buying, selling or valuations.\n
      \n
      4: No circuit design or repair, tools or component questions.\n
      \n
      5: No excessively promoting your own sites, social media, videos etc.\n
      \n
      ---\n
      \n
      *Ask questions in [discuss.tchncs.de/c/askelectronics](https://discuss.tchncs.de/c/askelectronics)*\n
      \n
      ---
      """
    +rules: null
    +subscriptionsCount: 1
    +entryCount: 43
    +entryCommentCount: 201
    +postCount: 1
    +postCommentCount: 3
    +isAdult: false
    +customCss: null
    +lastActive: DateTime @1723220252 {#276
      date: 2024-08-09 18:17:32.0 +02:00
    }
    +markedForDeletionAt: null
    +tags: null
    +moderators: Doctrine\ORM\PersistentCollection {#238 …}
    +ownershipRequests: Doctrine\ORM\PersistentCollection {#234 …}
    +moderatorRequests: Doctrine\ORM\PersistentCollection {#223 …}
    +entries: Doctrine\ORM\PersistentCollection {#181 …}
    +posts: Doctrine\ORM\PersistentCollection {#139 …}
    +subscriptions: Doctrine\ORM\PersistentCollection {#201 …}
    +bans: Doctrine\ORM\PersistentCollection {#118 …}
    +reports: Doctrine\ORM\PersistentCollection {#104 …}
    +badges: Doctrine\ORM\PersistentCollection {#82 …}
    +logs: Doctrine\ORM\PersistentCollection {#72 …}
    +awards: Doctrine\ORM\PersistentCollection {#61 …}
    +categories: Doctrine\ORM\PersistentCollection {#1820 …}
    -id: 5
    +apId: "electronics@discuss.tchncs.de"
    +apProfileId: "https://discuss.tchncs.de/c/electronics"
    +apPublicUrl: "https://discuss.tchncs.de/c/electronics"
    +apFollowersUrl: "https://discuss.tchncs.de/c/electronics/followers"
    +apInboxUrl: "https://discuss.tchncs.de/inbox"
    +apDomain: "discuss.tchncs.de"
    +apPreferredUsername: "electronics"
    +apDiscoverable: true
    +apManuallyApprovesFollowers: null
    +privateKey: null
    +publicKey: null
    +apFetchedAt: DateTime @1719675646 {#270
      date: 2024-06-29 17:40:46.0 +02:00
    }
    +apDeletedAt: null
    +apTimeoutAt: null
    +visibility: "visible             "
    +createdAt: DateTimeImmutable @1686642591 {#272
      date: 2023-06-13 09:49:51.0 +02:00
    }
  }
  +image: null
  +domain: Proxies\__CG__\App\Entity\Domain {#1912 …}
  +slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
  +title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
  +url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
  +body: """
    As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
    \n
    To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
    \n
    The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
    """
  +type: "link"
  +lang: "en"
  +isOc: false
  +hasEmbed: false
  +commentCount: 1
  +favouriteCount: 10
  +score: 0
  +isAdult: false
  +sticky: false
  +lastActive: DateTime @1694877465 {#2410
    date: 2023-09-16 17:17:45.0 +02:00
  }
  +ip: null
  +adaAmount: 0
  +tags: null
  +mentions: null
  +comments: Doctrine\ORM\PersistentCollection {#1866 …}
  +votes: Doctrine\ORM\PersistentCollection {#1978 …}
  +reports: Doctrine\ORM\PersistentCollection {#1946 …}
  +favourites: Doctrine\ORM\PersistentCollection {#1971 …}
  +notifications: Doctrine\ORM\PersistentCollection {#2443 …}
  +badges: Doctrine\ORM\PersistentCollection {#2426 …}
  +children: []
  -id: 2237
  -titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
  -bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
  +cross: false
  +upVotes: 0
  +downVotes: 0
  +ranking: 1694903121
  +visibility: "visible             "
  +apId: "https://discuss.tchncs.de/post/3338875"
  +editedAt: null
  +createdAt: DateTimeImmutable @1694874121 {#1850
    date: 2023-09-16 16:22:01.0 +02:00
  }
}
 
"Scheb\TwoFactorBundle\Security\Authorization\Voter\TwoFactorInProgressVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\EntryCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\EntryVoter"
 ACCESS DENIED 
"App\Security\Voter\MagazineVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageThreadVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\MessageVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\NotificationVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\OAuth2UserConsentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostCommentVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\PostVoter"
 ACCESS ABSTAIN 
"App\Security\Voter\UserVoter"
 ACCESS ABSTAIN
Show voter details
4 DENIED moderate 
App\Entity\Entry {#2388
  +user: Proxies\__CG__\App\Entity\User {#1943 …}
  +magazine: App\Entity\Magazine {#266
    +icon: Proxies\__CG__\App\Entity\Image {#247 …}
    +name: "electronics@discuss.tchncs.de"
    +title: "electronics"
    +description: """
      **Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
      \n
      Rules\n
      -----\n
      \n
      1: Be nice.\n
      \n
      2: Be on-topic (eg: *Electronic*, not *electrical*).\n
      \n
      3: No commercial stuff, buying, selling or valuations.\n
      \n
      4: No circuit design or repair, tools or component questions.\n
      \n
      5: No excessively promoting your own sites, social media, videos etc.\n
      \n
      ---\n
      \n
      *Ask questions in [discuss.tchncs.de/c/askelectronics](https://discuss.tchncs.de/c/askelectronics)*\n
      \n
      ---
      """
    +rules: null
    +subscriptionsCount: 1
    +entryCount: 43
    +entryCommentCount: 201
    +postCount: 1
    +postCommentCount: 3
    +isAdult: false
    +customCss: null
    +lastActive: DateTime @1723220252 {#276
      date: 2024-08-09 18:17:32.0 +02:00
    }
    +markedForDeletionAt: null
    +tags: null
    +moderators: Doctrine\ORM\PersistentCollection {#238 …}
    +ownershipRequests: Doctrine\ORM\PersistentCollection {#234 …}
    +moderatorRequests: Doctrine\ORM\PersistentCollection {#223 …}
    +entries: Doctrine\ORM\PersistentCollection {#181 …}
    +posts: Doctrine\ORM\PersistentCollection {#139 …}
    +subscriptions: Doctrine\ORM\PersistentCollection {#201 …}
    +bans: Doctrine\ORM\PersistentCollection {#118 …}
    +reports: Doctrine\ORM\PersistentCollection {#104 …}
    +badges: Doctrine\ORM\PersistentCollection {#82 …}
    +logs: Doctrine\ORM\PersistentCollection {#72 …}
    +awards: Doctrine\ORM\PersistentCollection {#61 …}
    +categories: Doctrine\ORM\PersistentCollection {#1820 …}
    -id: 5
    +apId: "electronics@discuss.tchncs.de"
    +apProfileId: "https://discuss.tchncs.de/c/electronics"
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        **Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
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      As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
      \n
      To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
      \n
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