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Rules\n
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8 |
DENIED
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moderate
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**Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
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Rules\n
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\n
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As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
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**Projects, pictures, industry discussions and news about electronic engineering & component-level electronic circuits.**\n
\n
Rules\n
-----\n
\n
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\n
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\n
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\n
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As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
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cross-posted from: [discuss.tchncs.de/post/3011500](https://discuss.tchncs.de/post/3011500)\n
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cross-posted from: [discuss.tchncs.de/post/3011500](https://discuss.tchncs.de/post/3011500)\n
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cross-posted from: [discuss.tchncs.de/post/3011500](https://discuss.tchncs.de/post/3011500)\n
\n
> Many volume applications use FPGA because they need in-field reconfigurability (changing standards, changing algorithms, etc) but they want to improve their system’s competitiveness (power, size, cost). FPGAs are bulky, expensive and power hungry. Integrating eFPGA can greatly improve the economics while maintaining full reconfigurability and performance.\n
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Topics covered in this informative video: potentiometer, electrical engineering, basic electronics, what is a resistor, resistors in series, variable resistor, power electronics, current limiting, Carbon film, carbon composite, Metal film, Potentiometer, Thermistor, RTD, LDR, Light dependant resistor, SMD, rheostat and much much more.\n
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The video often (not always) describes resistors as coiled wires. Don’t they induce magnetic fields and currents in other components? This article answered these questions for me: [eepower.com/…/resistor-inductance/#](https://eepower.com/resistor-guide/resistor-fundamentals/resistor-inductance/#)\n
\n
TL;DR: Yes, but the effect is often negligible or the application does not care. When it matters, we can minimize the effect with appropriate designs (i.e. without coiled resistors).
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Rules\n
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Rules\n
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29 |
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Rules\n
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32 |
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33 |
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Show voter details
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34 |
DENIED
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35 |
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36 |
DENIED
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Although you are probably not aware of them, dozens of electronic control units (ECUs) — printed circuit boards (PCBs) in metal or plastic housings — exist in your car to control and monitor the operation and safety of your vehicle’s many control systems. These units must work for the lifetime of your car, during which time they are subjected to many heating and cooling cycles. The most obvious cycle occurs when you start your car after it has cooled at night. It heats up as the car runs and then cools again when you shut it off. That’s one “ambient” temperature cycle.\n
\n
Additional so called “active” thermal cycles can occur locally within specific electronic components on the PCB. For instance, a MOSFET transistor draws a lot of current and heats up the PCB near its location, causing additional thermal cycling. These complex temperature distributions can cause local thermomechanical strain because differences in temperature across the PCB result in differential expansion of the board. Because the board is constrained by its housing, this can lead to bending of the board, putting additional strain on the solder joints that connect the components to the board.\n
\n
The widely used power law based approach — simulation of only few cycles and prognosis of solder joints lifetime — has many shortcomings, where no absolute lifetime prediction or the damage driven load relocation and its nonlinear evolution are captured. Youssef Maniar and Marta Kuczynska, engineers at Robert Bosch GmbH in Germany, have developed an accurate nonlinear damage model able to predict absolute lifetime of solder connections. The problem they faced, absolute lifetime prediction, involves simulation of all cycles imposed to the components, and the computational effort is therefore extensive. Then, about two years ago, they read an academic paper that described a way to “jump” over some cycles to accelerate simulation.\n
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Although you are probably not aware of them, dozens of electronic control units (ECUs) — printed circuit boards (PCBs) in metal or plastic housings — exist in your car to control and monitor the operation and safety of your vehicle’s many control systems. These units must work for the lifetime of your car, during which time they are subjected to many heating and cooling cycles. The most obvious cycle occurs when you start your car after it has cooled at night. It heats up as the car runs and then cools again when you shut it off. That’s one “ambient” temperature cycle.\n
\n
Additional so called “active” thermal cycles can occur locally within specific electronic components on the PCB. For instance, a MOSFET transistor draws a lot of current and heats up the PCB near its location, causing additional thermal cycling. These complex temperature distributions can cause local thermomechanical strain because differences in temperature across the PCB result in differential expansion of the board. Because the board is constrained by its housing, this can lead to bending of the board, putting additional strain on the solder joints that connect the components to the board.\n
\n
The widely used power law based approach — simulation of only few cycles and prognosis of solder joints lifetime — has many shortcomings, where no absolute lifetime prediction or the damage driven load relocation and its nonlinear evolution are captured. Youssef Maniar and Marta Kuczynska, engineers at Robert Bosch GmbH in Germany, have developed an accurate nonlinear damage model able to predict absolute lifetime of solder connections. The problem they faced, absolute lifetime prediction, involves simulation of all cycles imposed to the components, and the computational effort is therefore extensive. Then, about two years ago, they read an academic paper that described a way to “jump” over some cycles to accelerate simulation.\n
\n
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Although you are probably not aware of them, dozens of electronic control units (ECUs) — printed circuit boards (PCBs) in metal or plastic housings — exist in your car to control and monitor the operation and safety of your vehicle’s many control systems. These units must work for the lifetime of your car, during which time they are subjected to many heating and cooling cycles. The most obvious cycle occurs when you start your car after it has cooled at night. It heats up as the car runs and then cools again when you shut it off. That’s one “ambient” temperature cycle.\n
\n
Additional so called “active” thermal cycles can occur locally within specific electronic components on the PCB. For instance, a MOSFET transistor draws a lot of current and heats up the PCB near its location, causing additional thermal cycling. These complex temperature distributions can cause local thermomechanical strain because differences in temperature across the PCB result in differential expansion of the board. Because the board is constrained by its housing, this can lead to bending of the board, putting additional strain on the solder joints that connect the components to the board.\n
\n
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\n
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cross-posted from: [discuss.tchncs.de/post/3157319](https://discuss.tchncs.de/post/3157319)\n
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> Compared with traditional monolithic devices, the design and manufacturing process for chiplets is significantly different. The scrap costs associated with manufacturing traditional monolithic semiconductor devices is basically linear, including single chip cost, packaging, and assembly costs.\n
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cross-posted from: [discuss.tchncs.de/post/3157319](https://discuss.tchncs.de/post/3157319)\n
\n
> Compared with traditional monolithic devices, the design and manufacturing process for chiplets is significantly different. The scrap costs associated with manufacturing traditional monolithic semiconductor devices is basically linear, including single chip cost, packaging, and assembly costs.\n
> \n
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cross-posted from: [discuss.tchncs.de/post/3157319](https://discuss.tchncs.de/post/3157319)\n
\n
> Compared with traditional monolithic devices, the design and manufacturing process for chiplets is significantly different. The scrap costs associated with manufacturing traditional monolithic semiconductor devices is basically linear, including single chip cost, packaging, and assembly costs.\n
> \n
> Manufacturing processes for 2.5D/3D designs differ significantly in terms of the accumulation of scrap costs. Specifically, these costs increase geometrically from fabrication to assembly driven by scrap costs for multiple dies, multi-chip partial assemblies, and/or full 2.5D/3D packages.\n
> \n
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