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        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
      \n
      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
      \n
      Ideally the copper area is big to spread out the heat. If you have an isolated polygon it can’t spread very far and buys you less cooling.
      """
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        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
      \n
      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
      \n
      Ideally the copper area is big to spread out the heat. If you have an isolated polygon it can’t spread very far and buys you less cooling.
      """
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      cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
      \n
      > Hello everyone, I need some advice.\n
      > \n
      > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
      > \n
      > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
      > \n
      > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
      > \n
      > Thanks!\n
      > \n
      > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
      > \n
      > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
      > \n
      > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
      """
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    +body: """
      cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
      \n
      > Hello everyone, I need some advice.\n
      > \n
      > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
      > \n
      > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
      > \n
      > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
      > \n
      > Thanks!\n
      > \n
      > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
      > \n
      > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
      > \n
      > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
      """
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        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
      \n
      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
      \n
      Ideally the copper area is big to spread out the heat. If you have an isolated polygon it can’t spread very far and buys you less cooling.
      """
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        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
      \n
      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
      \n
      Ideally the copper area is big to spread out the heat. If you have an isolated polygon it can’t spread very far and buys you less cooling.
      """
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        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
      \n
      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
      \n
      Ideally the copper area is big to spread out the heat. If you have an isolated polygon it can’t spread very far and buys you less cooling.
      """
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      +body: """
        cross-posted from: [sh.itjust.works/post/13637559](https://sh.itjust.works/post/13637559)\n
        \n
        > Hello everyone, I need some advice.\n
        > \n
        > I am making custom PCBs for a project of mine. It’s basically for a little remotely controlled robot using little DC motors. I chose the Seeed Studio XIAO ESP32C3 as the uC since it has inbuilt wifi/bt, 3.3V regulator that I can use to power the motors (can source up to 700mA) and lipo charging management (the robots will run on battery). As you can see from [here](https://www.seeedstudio.com/Seeed-XIAO-ESP32C3-p-5431.html), the microcontroller is surface mounted and the pads for the battery are on the bottom layer. Same story goes for the thermal pad of the microcontroller and the thermal pad of the motor driver ([datasheet](https://www.tme.eu/Document/9504b4c07574a91a7b207d08475bca04/A3901.pdf)). I have worked with SMD components in the past and can solder them by hand, but I have never worked with SMD components that have thermal pads on the bottom layer. My question is: how to manage (route?) them? My PCB is 2-layer and I was planning on having both layers filled with a ground plane. Do I just connect thermal pads to the ground plane and call it a day? Wouldn’t that make the components hard to solder with hot air? Do I make an isolated polygon that only acts as a thermal pad?\n
        > \n
        > Speaking of soldering is even hot air the way to go in this case? My PCB has components on both sides, and I was planning on ordering stencils together with the boards and using solder paste, placing the components and then using hot air to solder the components in place. I thought a hot plate would be better but I don’t have access to one and I don’t know how that works with components on both sides.\n
        > \n
        > I attached some photos of the PCB in Kicad, and [here’s](https://github.com/EmaMaker/AMazeIng-robots) the git repo. If it is of any help, I’m planning of having them manifactured by JLCPCB. It is also my first time using KiCad, so go easy on me :)\n
        > \n
        > Thanks!\n
        > \n
        > [![](https://files.catbox.moe/ztw2pb.png)](https://files.catbox.moe/ztw2pb.png)\n
        > \n
        > [![](https://files.catbox.moe/hytn9j.png)](https://files.catbox.moe/hytn9j.png)\n
        > \n
        > [![](https://files.catbox.moe/l9nqcb.png)](https://files.catbox.moe/l9nqcb.png)
        """
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      > Do I just connect thermal pads to the ground plane and call it a day?\n
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      Yup.\n
      \n
      > Wouldn’t that make the components hard to solder with hot air?\n
      \n
      Sorry, I’ve never tried hot air assembly.\n
      \n
      > Do I make an isolated polygon that only acts as a thermal pad?\n
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      """
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          **For questions about component-level electronic circuits, tools and equipment.**\n
          \n
          Rules\n
          -----\n
          \n
          1: Be nice.\n
          \n
          2: Be on-topic (eg: *Electronic*, not *electrical*).\n
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          \n
          4: Be safe.\n
          \n
          ---
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      +slug: "Temporary-pull-up-during-boot-ESP-01"
      +title: "Temporary pull-up during boot (ESP-01)"
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        Hi everyone!\n
        \n
        I’m trying to control a “dumb” led light strip segment with an ESP-01S. This is fairly low current, the strip will pull 150mA-200mA max (depends on… artistic? needs).\n
        \n
        I have two NPN transistors (2N2222), one to control the 12V supply to the white “channel” and the other the red+blue (don’t need the green).\n
        \n
        I had to pull-down the gates as I had some flickering, and it works perfectly if I manually connect the GPIOs **after** the ESP-01S boots.\n
        \n
        The ESP will boot if I have the RX pin (GPIO03) pulled down on boot, but not if I pull down any of the others.\n
        \n
        I’m not smart enough to come up with a way to have that extra pin I need to be high only during boot, while the gate it’s attached to needs to be pulled down…\n
        \n
        Any thought, other than getting something with more IO pins?
        """
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      +body: "Would a circuit like [this power-on reset circuit](https://electronics.stackexchange.com/questions/630155/question-about-capacitor-and-resistor-in-power-on-reset-circuit) work for your application?"
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    +body: """
      The 7333A is a linear regulator, which means it drops voltage by converting power to heat. Typically those make sense when the input voltage is close to the output voltage or the load is *very* small. If it’s getting too hot, the load is high enough that the efficiency will be very bad…whether or not this is a problem depends on your application.\n
      \n
      Some random site claims 170mA and another claims up to 400mA. 170mA * 8.7V (12V in minus 3.3V out) = about 1.5 watts, which is too much for a TO-92 package.\n
      \n
      Can you use a tiny buck converter instead? Or a larger package for the linear regulator that can add a small heat sink?\n
      \n
      As for your actual circuit, the second transistor is an interesting idea (you’re using it to invert the state so you can have the GPIO pulled in the non-problematic direction?) and I don’t have enough experience to give further suggestions.
      """
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