1 |
DENIED
|
ROLE_USER
|
null |
|
Show voter details
|
2 |
DENIED
|
moderate
|
Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
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DENIED
|
edit
|
Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
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|
moderate
|
Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
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|
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|
null |
|
Show voter details
|
6 |
DENIED
|
moderate
|
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
} |
|
Show voter details
|
7 |
DENIED
|
edit
|
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
} |
|
Show voter details
|
8 |
DENIED
|
moderate
|
App\Entity\EntryComment {#1675
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1560
+user: Proxies\__CG__\App\Entity\User {#1908 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#2363 …}
+slug: "Advancing-Cu-Cu-Hybrid-Bonding-Overcoming-Challenges-for-the-Future-of"
+title: "Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal"
+url: "https://www.microwavejournal.com/articles/40845-advancing-cu-cu-hybrid-bonding-overcoming-challenges-for-the-future-of-semiconductor-packaging"
+body: """
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor irregularities can compromise successful bonding.\n
\n
To overcome these issues, Cu-Cu hybrid bonding technology steps in as a game-changer. This innovative technique involves embedding metal contacts between dielectric materials and using heat treatment for solid-state diffusion of copper atoms, thereby eliminating the bridging problem associated with soldering.\n
\n
The advantages of hybrid bonding over flip-chip soldering are obvious. Firstly, it enables ultra-fine pitch and small contact sizes, facilitating high I/O counts. This is critical in modern semiconductor packaging, where devices require a growing number of connections to meet performance demands. Secondly, unlike flip-chip soldering, which often relies on underfill materials, Cu-Cu hybrid bonding eliminates the need for underfill, reducing parasitic capacitance, resistance and inductance, as well as thermal resistance. Lastly, the reduced thickness of the bonded connections in Cu-Cu hybrid bonding, nearly eliminating the 10 to 30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for more compact and efficient semiconductor packages.
"""
+type: "link"
+lang: "en"
+isOc: false
+hasEmbed: false
+commentCount: 1
+favouriteCount: 10
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1694877465 {#1795
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#2370 …}
+votes: Doctrine\ORM\PersistentCollection {#2360 …}
+reports: Doctrine\ORM\PersistentCollection {#2364 …}
+favourites: Doctrine\ORM\PersistentCollection {#1739 …}
+notifications: Doctrine\ORM\PersistentCollection {#2465 …}
+badges: Doctrine\ORM\PersistentCollection {#1732 …}
+children: [
App\Entity\EntryComment {#1675}
]
-id: 2237
-titleTs: "'advanc':1 'bond':6 'challeng':8 'cu':3,4 'cu-cu':2 'futur':11 'hybrid':5 'journal':16 'microwav':15 'overcom':7 'packag':14 'semiconductor':13"
-bodyTs: "'10':193 '30':195 'advantag':98 'area':14 'aris':8 'associ':94 'atom':88 'avoid':31 'ball':200 'becom':40 'bond':16,49,58,101,159,182,189 'bridg':92 'bump':3,10 'capacit':167 'changer':66 'chip':105,147,204 'co':35 'co-planar':34 'compact':212 'compromis':47 'connect':25,138,183 'contact':73,118 'copper':87 'count':123 'critic':33,126 'cu':55,56,156,157,186,187 'cu-cu':54,155,185 'demand':142 'devic':132 'dielectr':75 'difficult':20 'diffus':85 'effici':214 'electr':24 'elimin':90,160,191 'embed':71 'enabl':111 'error':32 'establish':22 'even':43 'facilit':120 'fine':114 'first':109 'flip':104,146,203 'flip-chip':103,145,202 'game':65 'game-chang':64 'grow':135 'heat':79 'height':11 'high':121 'hybrid':57,100,158,188 'i/o':122 'increas':19 'induct':170 'innov':68 'involv':70 'irregular':45 'issu':7,53 'last':176 'make':17 'manufactur':28 'materi':76,154 'meet':140 'metal':72 'micron':196 'minor':44 'modern':128 'near':190 'necessit':26 'need':162 'new':208 'number':136 'obvious':108 'often':150 'open':206 'overcom':51 'packag':130,216 'paramount':41 'parasit':166 'perform':141 'pitch':4,115 'planar':36 'possibl':209 'precis':27 'problem':93 'process':29 'reduc':9,165,178 'reli':151 'reliabl':23 'requir':133 'resist':168,175 'rough':39 'second':143 'semiconductor':129,215 'sever':6 'shrink':5 'size':119 'small':117 'solder':2,96,106,148,199 'solid':83 'solid-st':82 'state':84 'step':60 'success':48 'surfac':13,38 'techniqu':69 'technolog':59,205 'therebi':89 'thermal':174 'thick':179,197 'treatment':80 'ultra':113 'ultra-fin':112 'underfil':153,164 'unlik':144 'use':78 'well':172"
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1694903121
+visibility: "visible "
+apId: "https://discuss.tchncs.de/post/3338875"
+editedAt: null
+createdAt: DateTimeImmutable @1694874121 {#1597
date: 2023-09-16 16:22:01.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1548 …}
+image: null
+parent: null
+root: null
+body: "Probably also makes for faster assembly times"
+lang: "en"
+isAdult: false
+favouriteCount: 0
+score: 0
+lastActive: DateTime @1694877465 {#1610
date: 2023-09-16 17:17:45.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@hardware26@discuss.tchncs.de"
]
+children: Doctrine\ORM\PersistentCollection {#1559 …}
+nested: Doctrine\ORM\PersistentCollection {#1567 …}
+votes: Doctrine\ORM\PersistentCollection {#1561 …}
+reports: Doctrine\ORM\PersistentCollection {#1528 …}
+favourites: Doctrine\ORM\PersistentCollection {#1562 …}
+notifications: Doctrine\ORM\PersistentCollection {#1582 …}
-id: 29250
-bodyTs: "'also':2 'assembl':6 'faster':5 'make':3 'probabl':1 'time':7"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3962440"
+editedAt: null
+createdAt: DateTimeImmutable @1694877465 {#1615
date: 2023-09-16 17:17:45.0 +02:00
}
+"title": 29250
} |
|
Show voter details
|
9 |
DENIED
|
ROLE_USER
|
null |
|
Show voter details
|
10 |
DENIED
|
moderate
|
Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
11 |
DENIED
|
edit
|
Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
12 |
DENIED
|
moderate
|
Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620 …2}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
} |
|
Show voter details
|
13 |
DENIED
|
ROLE_USER
|
null |
|
Show voter details
|
14 |
DENIED
|
moderate
|
App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
} |
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Show voter details
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15 |
DENIED
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edit
|
App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
} |
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Show voter details
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moderate
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App\Entity\EntryComment {#1604
+user: App\Entity\User {#260 …}
+entry: Proxies\__CG__\App\Entity\Entry {#1620
+user: Proxies\__CG__\App\Entity\User {#1616 …}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+domain: Proxies\__CG__\App\Entity\Domain {#1737 …}
+slug: "28-August-2023"
+title: "28 August 2023"
+url: "https://i.imgur.com/02GD5cB.jpg"
+body: null
+type: "image"
+lang: "en"
+isOc: false
+hasEmbed: true
+commentCount: 14
+favouriteCount: 11
+score: 0
+isAdult: false
+sticky: false
+lastActive: DateTime @1693492394 {#1733
date: 2023-08-31 16:33:14.0 +02:00
}
+ip: null
+adaAmount: 0
+tags: null
+mentions: null
+comments: Doctrine\ORM\PersistentCollection {#1383 …}
+votes: Doctrine\ORM\PersistentCollection {#2392 …}
+reports: Doctrine\ORM\PersistentCollection {#1385 …}
+favourites: Doctrine\ORM\PersistentCollection {#2395 …}
+notifications: Doctrine\ORM\PersistentCollection {#1384 …}
+badges: Doctrine\ORM\PersistentCollection {#1404 …}
+children: [
App\Entity\EntryComment {#1604}
]
-id: 5436
-titleTs: "'2023':3 '28':1 'august':2"
-bodyTs: null
+cross: false
+upVotes: 0
+downVotes: 0
+ranking: 1693418068
+visibility: "visible "
+apId: "https://lemm.ee/post/5928743"
+editedAt: null
+createdAt: DateTimeImmutable @1693331668 {#1736
date: 2023-08-29 19:54:28.0 +02:00
}
+__isInitialized__: true
…2
}
+magazine: Proxies\__CG__\App\Entity\Magazine {#1557 …}
+image: null
+parent: null
+root: null
+body: "PTSD and CPTSD are very real and very damaging. Get the help you need without feeling shame. Nobody bats an eye if you go to a doctor for a physical ailment; mental issues should be treated with the same understanding."
+lang: "en"
+isAdult: false
+favouriteCount: 2
+score: 0
+lastActive: DateTime @1693335279 {#1590
date: 2023-08-29 20:54:39.0 +02:00
}
+ip: null
+tags: null
+mentions: [
"@MrSebSin@lemm.ee"
]
+children: Doctrine\ORM\PersistentCollection {#1555 …}
+nested: Doctrine\ORM\PersistentCollection {#1619 …}
+votes: Doctrine\ORM\PersistentCollection {#1701 …}
+reports: Doctrine\ORM\PersistentCollection {#1687 …}
+favourites: Doctrine\ORM\PersistentCollection {#1689 …}
+notifications: Doctrine\ORM\PersistentCollection {#1691 …}
-id: 79694
-bodyTs: "'ailment':31 'bat':19 'cptsd':3 'damag':9 'doctor':27 'eye':21 'feel':16 'get':10 'go':24 'help':12 'issu':33 'mental':32 'need':14 'nobodi':18 'physic':30 'ptsd':1 'real':6 'shame':17 'treat':36 'understand':40 'without':15"
+ranking: 0
+commentCount: 0
+upVotes: 0
+downVotes: 0
+visibility: "visible "
+apId: "https://hexbear.net/comment/3846842"
+editedAt: null
+createdAt: DateTimeImmutable @1693335279 {#1613
date: 2023-08-29 20:54:39.0 +02:00
}
+"title": 79694
} |
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