electronics

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Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal (www.microwavejournal.com)

As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor...

Jumping Over Thermal Cycles Accelerates Thermomechanical Fatigue Simulations (semiengineering.com)

Although you are probably not aware of them, dozens of electronic control units (ECUs) — printed circuit boards (PCBs) in metal or plastic housings — exist in your car to control and monitor the operation and safety of your vehicle’s many control systems. These units must work for the lifetime of your car, during which...

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