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Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal (www.microwavejournal.com)
As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor...
28 August 2023 (i.imgur.com)