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Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal (www.microwavejournal.com)

As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor...

The original winning design for the flag of Malaysia. IMO a nicer flag, without any inadvertent associations to Liberia and USA. (upload.wikimedia.org)

This flag won a nationwide poll in 1949, but some changes were made to it afterwards, leading to the Malaysian flag we know today. The reason for these changes seems somewhat unclear, more than that the politician Onn Jaafar suggested them....

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