Depending on the power consumption, you may consider not using thermal relief while connecting thermal vias for the chip (component 57) to ground layers. But this may make soldering harder so do it only if needed. Thermal vias are so close that they form 3 long dents in 3v3 plane. It is good practice to put vias a little far apart so that planes can go through between vias. This can be important since sometimes lowest impedance can be obtained when current is flowing between those vias. If you don’t need to fit 15 vias there, you may consider reducing the number and separating them a bit. You can also check the design rules for minimum copper width and minimum via clearance for your manufacturer and enter them in your CAD tool.
On a more on topic note: Lemmy is small. We dont have the population to warrant that specific of a community, yet. I’d recommend starting by joining a community about vinyl, making posts about vinyl care, and seeing how they do. When you’re taking up a significant percentage of a larger parent topics feed, I’d say it’s time to splinter off
I’d just add that we run the risk of being extremely unappealing if we have too many communities with near 0 activity. We’re better served at the beginning having fewer, more general communities, to attract critical masses
It’s also a problem with algorithms. Big communities drown out smaller ones because the sorting only looks at absolute numbers. Change is underway though.
I am gonna be a lil wary about breathing while very close to my records now, I should’ve guessed there was something terrible about the big fun plastic music discs 😭 thank you for sharing the video!
Yes, but how about the artists that pressed their recordings only on vinyl? There are scores of artists that may have only made a couple thousand records and will be lost to time without people saving them.
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