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Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging | Microwave Journal (www.microwavejournal.com)

As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise manufacturing processes to avoid errors. Critical co-planarity and surface roughness become paramount, as even minor...

Induction and high-end pans

So after some research I splurged for a Demeyere Proline 7-ply frying pan. Unfortunately, upon trying it with my induction stove it gave an error message saying that the pan was incompatible. My internet research tells me that it could be due to the copper core of the Demeyre causing a high current draw. Another reason could be...

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